S670 designed with super strong sheet metal works which is extremely durable as a tank mechanism, all chassis adopted the enhanced less-cable and mechanical construction design, the surface or the sheet metal's edge won't have any sharp burs while installing the system integration by hands, combine the strong cooling system control, it's the most ideal system for your HPC system. Regarding the motherboard compatibility, it supports all specification such as Intel Dual Core Xeon LGA 771, Intel Socket 775 P4 as well as AMD Dual Core Opteron Socket 1207(F) and AM2 platform. This high-density server also designed to meet the diverse and demanding needs of today's enterprise-class computing environment such as RAID system application, through 32 hotswap hard drives and two 5.25" CD bay capacity, and thermal-correct cooling design with this platform, the heat at processors and inside chassis keep cool running for 24 hours a day. It supports 1350W redundant power supply sources that keep the system stable and mission critical.

* Drive bay:    32 x SATAII/SAS hotswap mobile racks, 2 x 5.25" CD bay    (S670SATAII)    32 x SCSI hotswap mobile racks, 2 x 5.25" CD bay    (S670SCSI) * with aluminum extrusion heatsinks help HDD's cooling * build-in People FasTech intelligent device (fan fail, LCD temp, USB 2.0) * build-in 1,350W redundant power supply with PFC * with 3 intake 120x38mm ball bearing fans * support eATX 12" x 13" MB, Intel EEB 3.61 and CEB1.01 * support 7 slot full height (max. 342mm depth) expansion card * black colored painting as standard * chassis dimension: 19" x 6U x 25" (633m deep) * chassis' package information: NW xxx KGM, GW xxx KGM    (with power supply installed),  xxx CUFT (two boxes packed)